Final call for industry scholarship

A leading industry scholarship will close its application process on Friday as one industry leader has urged those considering an application to put themselves forward.

Insurance News

By Jordan Lynn

Applications for the W + K APIG Scholarship close this Friday and an industry leader has backed those thinking of applying to step forward and enter.

The scholarship, which will see one lucky winner travel to the United Kingdom to attend the 20th annual Professional Indemnity Forum, is aimed at young members of APIG and gives a “fantastic opportunity” to experience the global industry, W + K partner Andrew Moore told Insurance Business.

“This is a fantastic opportunity for a talented young APIG member to travel to the UK,” Moore said.

“Not only will the winner attend the 20th Annual Professional Indemnity Forum Conference but they will also have the opportunity to sit in a box at Lloyd’s and watch an underwriter at work.”

Moore noted that the law firm became involved with the scholarship program as a way of inspiring younger members of the industry in a bid to strengthen the future of the industry as a whole.

“Helping to develop young talent is critical to the ongoing success of the insurance industry,” Moore continued.

“There is no such thing as enough when it comes to inspiring younger members.  It should always be an ongoing and constant process.

“W+K wanted to recognise individuals who have contributed to financial lines insurance in Australia.”

APIG and W + K have a long history of working together and Moore noted that offering the scholarship was the next logical step in the relationship as both organisations are passionate about industry education.

"W+K has a long history of supporting APIG having been a gold sponsor of the National Conference for six years. This was the next logical step in terms of partnering with a voluntary organisation committed to educating the insurance industry," Moore continued.

To apply for the scholarship or to find out more, click here.

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